Imaging Resource posted their full E-M5II review and writes:

Perhaps where the Olympus E-M5 II impressed us most was when we had to crank up the sensitivity to shoot in low light, though. Its high ISO performance belies its Micro Four Thirds sensor size, and actually manages to rival some APS-C sensor-based cameras! All things considered, this is one heck of a package, and at a very competitive price as well. It is, perhaps, one of the best arguments yet we’ve seen for the rise of the mirrorless camera!

E-M5II store links:
E-M5II in Black at Amazon, Adorama, BHphoto and GetOlympus.
E-M5II in Silver at Amazon, Adorama, BHphoto and GetOlympus.
E-M5II In Europe at AmazonUK, Jessops, WexUK, Namencolor.
First E-M5II leather case on eBay in [shoplink 52300 ebay]Full Black (Click here)[/shoplink] or in [shoplink 52301 ebay]Full Brown (Click here)[/shoplink].

The new Olympus PRO lens manuals are now available for download:
7-14mm PDF manual: support.olympus.co.jp/jp/support/dlc/archive/man_mzded714f28.pdf
8mm PDF manual: support.olympus.co.jp/jp/support/dlc/archive/man_mzded8f18.pdf

Olympus Preorders:
7-14mm f/2.8 PRO lens: Amazon, Adorama, BHphoto, GetOlympus, WexUK, AmazonUK, AmazonDE, Digitalrev.
8mm f/1.8 PRO lens: Amazon, Adorama, BHphoto, GetOlympus, WexUK, AmazonUK, AmazonDE, Digitalrev.
Titanium E-M5II: Amazon, Adorama, BHphoto, GetOlympus, WexUK.

Thanks to the anonymous source who shared this.

ImagineVision announced a new 4K capable Micro Four Thirds camera. It has a 16MP sensor and can shoot up to 102,400 ISO. It’s meant to be used remotly and as a drone camera. If you can read Japanese you get the full info here: imaginevision-tech.com.

(Click to enlarge the image)

Reminder: Months ago VLSsymposium (PDF file here) unveiled the first info about the new 16MP 3D stacked Olympus sensor:

A 3D stacked CMOS Image Sensor with Global-shutter mode and high speed capturing mode:
The paper by Toru Kondo et al. from Olympus Corp. will describe a 16Mpixel 3D stacked CMOS image sensor with pixel level interconnections using 4 million micro bumps.

The two semiconductor substrates are bonded by a 7.6um pitch micro-bump array, and the storage node array is comprised on the bottom substrate to improve parasitic light sensitivity (PLS). Both a 16Mpixel global-shutter mode with a -180dB PLS and 2Mpixel 10000fps high speed image capturing are achieved. (Paper C4-5, “A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode and 2Mpixel 10000fps mode using 4 million interconnections,” Toru Kondo et al., Olympus Corp.)