VLSsymposium (PDF file here) unveiled some more info about the new 16MP 3D stacked Olympus sensor:
A 3D stacked CMOS Image Sensor with Global-shutter mode and high speed capturing mode:
The paper by Toru Kondo et al. from Olympus Corp. will describe a 16Mpixel 3D stacked CMOS image sensor with pixel level interconnections using 4 million micro bumps.
The two semiconductor substrates are bonded by a 7.6um pitch micro-bump array, and the storage node array is comprised on the bottom substrate to improve parasitic light sensitivity (PLS). Both a 16Mpixel global-shutter mode with a -180dB PLS and 2Mpixel 10000fps high speed image capturing are achieved. (Paper C4-5, “A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode and 2Mpixel 10000fps mode using 4 million interconnections,” Toru Kondo et al., Olympus Corp.)